High-Power UVC LED Thermal Substrate - Copper-Plated CVD Polycrystalline Diamond for 265nm-275nm Disinfection Chips

High-Power UVC LED Thermal Substrate - Copper-Plated CVD Polycrystalline Diamond for 265nm-275nm Disinfection Chips 

Product Name: Ultra-Thin Precision Metallized CVD Diamond for Micro-LED Displays and Pico-Laser Projectors

• Product Introduction: An ultra-thin (100μm - 300μm) CVD polycrystalline diamond substrate with precision copper/gold plating. Designed for the microscopic thermal management required by AR/VR Micro-LED arrays and compact laser projection light engines.

• Performance:

• Flatness: < 5μm across a 2-inch wafer.

• Micro-metallization: Capable of precision patterning for individual pixel heat sinks.

• Thermal Conductivity: 1500+ W/m·K.

• Features:

• Compatible with thin-film deposition and micro-lithography processes.

• Low mass and high stiffness for mobile device integration.

• Ultra-low impurity (Nitrogen < 5ppm) for maximum thermal transparency.

• Applications: Smart glasses (AR), VR headsets, micro-projectors, and high-speed fiber-optic LED transmitters.

• Advantages: Enables ultra-compact designs by reducing the need for bulky active cooling (fans/liquid), essential for wearable tech.