Introduction to Diamond Heat Sinks

Product Specifications

Product Overview

INFI ADVANCED MATERIALS CO.,LTD is dedicated to providing large-size, high-thermal-conductivity diamond heat dissipation materials suitable for high-power electronic devices, lasers, semiconductor devices, and other fields. The company's products include: CVD single crystal diamond, CVD polycrystalline diamond, diamond-coated copper sheets, and diamond-copper composite materials.

1. CVD Single Crystal Diamond

Description

Single crystal diamond prepared by chemical vapor deposition, featuring extremely high thermal conductivity and hardness, suitable for high-precision optics and high-performance heat dissipation applications.

Specifications

·Size: 1–30 mm, thickness 0.05–5.0 mm (customizable)

·Thermal Conductivity: 1800–2200 W/m·K

·Hardness: Mohs hardness 10

·Transparency: Highly transparent in visible and infrared light

ranges

Applications

Heat dissipation for high-power lasers, high-precision optical components

Application Cases

·High-Power Lasers: CVD single crystal diamond substrates quickly dissipate heat generated during laser operation, maintaining laser output stability and improving laser efficiency and lifespan.

·Optical Equipment: In high-precision optical applications, CVD single crystal diamond as a heat dissipation material effectively prevents degradation of optical performance caused by temperature changes.

2. CVD Polycrystalline Diamond

Description

Polycrystalline diamond prepared by chemical vapor deposition, offering high thermal conductivity and mechanical strength, suitable for various industrial processing and heat dissipation applications.

Specifications

·Size: Diameter 1–150 mm, thickness 0.1–3.0 mm (customizable)

·Thermal Conductivity: 1200–1800 W/m·K

·Hardness: Mohs hardness 9.5

Applications

Industrial cutting tools, heat sinks

Application Cases

·High-Power Electronic Devices: Used for heat dissipation in high-power integrated circuits and RF devices, significantly enhancing thermal management capabilities and preventing performance degradation and failure due to overheating.

·LED Lighting: In high-power LED lighting, CVD polycrystalline diamond effectively dissipates large amounts of heat, extending LED lifespan and improving luminous efficiency.

3. Diamond-Coated Copper Sheet

Description

Diamond-coated copper sheets adopt a single crystal/polycrystalline diamond and thin copper sandwich structure, combining the high thermal conductivity of diamond with the excellent electrical conductivity of copper.

Specifications

·Size: Customized according to customer requirements

·Thermal Conductivity: 600–800 W/m·K

·Thickness: Diamond layer 0.3–1.0 mm, copper layer 0.1–0.5 mm

Applications

Heat dissipation for high-power electronic devices, power modules

Application Cases

·Power Modules: For heat dissipation in high-power modules, diamond-coated copper sheets provide excellent thermal conductivity while maintaining good electrical conductivity, ensuring stable module operation.

·Microelectronic Devices: In microelectronic devices, diamond-coated copper sheets effectively address thermal management issues, preventing performance degradation caused by heat accumulation.

4. Flexible Diamond Film

Description

Flexible diamond film is an innovative material product created using a unique edge-exposure peeling method with tape stripping technology, achieving ultra-thin and flexible diamond films. This retains the excellent physical and chemical properties of diamond while obtaining bendable and stretchable mechanical characteristics.

Specifications

·Size: Up to 8 inches, thickness controllable between 0.5–30 µm

·Thermal Conductivity: 1200–2000 W/m·K

·Roughness: <1 nm, achieving ultra-smooth surfaces

·Mechanical Properties: Flexible, bendable up to 360°

·Electrical Conductivity: Can be insulating or doped to become conductive

Application Cases

·Power Chips: Flexible diamond film as a heat dissipation layer effectively reduces device operating temperatures, improving reliability and lifespan. Particularly in flexible displays and wearable devices, traditional metal or graphite heat dissipation layers often struggle to balance flexibility and thermal conductivity, whereas flexible diamond film achieves both efficient heat dissipation and flexible deformation.

Detailed Application Areas and Pain Point Solutions

High-Power Electronic Devices

Pain Point Solutions

·Improved Heat Dissipation: The ultra-high thermal conductivity (1800–2200 W/m·K) and extremely low thermal expansion coefficient (1.0 × 10⁻⁶/K) of CVD single crystal diamond effectively manage heat, preventing device overheating and maintaining stable performance.

·Reliability and Lifespan: Due to the high hardness and chemical stability of diamond materials, high-power electronic devices can operate stably over long periods in high-temperature and harsh environments, reducing failure rates.

Lasers

Pain Point Solutions

·Thermal Management: CVD single crystal diamond substrates provide excellent thermal conductivity, rapidly dissipating heat and ensuring temperature stability during high-power laser operation, preventing thermal deformation and optical performance degradation.

·Optical Performance: Its high transparency in visible and infrared light ranges minimizes heat loss and improves laser output efficiency.

Semiconductor Devices

Pain Point Solutions

·Thermal Density Management: High thermal conductivity materials (such as CVD polycrystalline diamond and diamond-coated copper sheets) effectively dissipate heat, managing high-power density and preventing performance degradation caused by overheating.

·Compact Design: Diamond-copper composite materials combine the high thermal conductivity of diamond with the mechanical properties of copper, enabling more compact heat dissipation solutions and improving integration and performance.

Communication Equipment

Pain Point Solutions

·Thermal Stability: The high thermal conductivity of diamond materials ensures stable operation of communication equipment in high-frequency environments, preventing performance instability and failures caused by overheating.

·Equipment Lifespan: Effective heat dissipation management reduces thermal stress, improving long-term reliability and lifespan of equipment.