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BDD
Infi
BDD02505
1-8 Inch Polycrystalline Diamond Heat Spreader for AI Accelerator & High-Power RF Devices
Product Advantage:
· Ultra-high thermal conductivity: Exceeds 1500 W/m·K, providing 4 times better cooling performance than copper.
· Low coefficient of thermal expansion (CTE): With a low CTE (~1 ppm/K), it prevents stress on SiC/GaN chips.
· Chemical stability: Resistant to corrosion and oxidation, ensuring long-term reliability.
· Lightweight design: Significantly lighter than metal heat sinks used in portable technology.
· Broad range of applications: Ideal for high-power lasers, RF devices, and CPUs.
Product Photas: