Diamond Heat Sink for Chip Packaging

CVD diamond heat sinks for chip package thermal management.

The core function is to spread heat from a hotspot to a larger area, reducing heat flux density inside the package.

This is our fifteen hundred plus watts per meter Kelvin grade. This is our eighteen hundred plus grade for higher performance.

Standard sizes: five by five and seven by seven millimeters for hotspot applications. Ten by ten millimeters is the most practical size for package-level evaluation.

We supply both polycrystalline and single-crystal CVD diamond. Custom size and thickness are supported.

Applications include AI chips, GPU, CPU, power devices, RF modules, and laser diode packaging.

Sample order is available for evaluation. Contact us with your target specification.