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This video introduces our comprehensive range of diamond heat spreader materials – high-thermal-conductivity solutions designed for advanced electronics cooling applications.
CVD diamond offers exceptional thermal conductivity, reaching up to 2200 W/m·K – approximately five times higher than copper . This makes diamond heat spreaders ideal for managing heat in high-power-density devices where traditional materials fall short.
Our diamond heat spreader products include:
CVD Single Crystal Diamond – Supports stereo microchannel processing for advanced cooling architectures
CVD Polycrystalline Diamond – Available in diameters from 1mm to 150mm, thickness from 0.1mm to 3mm (customizable), with thermal conductivity ranging from 1200 to 1800 W/m·K
Diamond with Copper Coating – Metalized surface for excellent electrical conductivity and direct solderability
Key Applications:
High-power electronics and RF devices
Laser diodes and optoelectronics
Semiconductor packaging
Power modules and GaN/SiC devices
Research shows that integrating diamond heat spreaders can reduce junction temperatures by over 200°C under high-power operation and provide up to 100% increase in power-handling capability . The material's low coefficient of thermal expansion also ensures compatibility with semiconductor materials like GaAs and Si .
Customization Options:
Beyond our standard products, we offer custom diamond heat spreader solutions tailored to your specific dimensions, thermal requirements, and integration needs. Contact us to discuss your project requirements.
Watch the video to learn more about how our diamond heat spreader materials can solve your most challenging thermal management problems.
