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INFI
Extreme Chemical Processing: Microreactors for supercritical fluids and high-throughput catalyst screening chips.
The Principle of Diamond Microchannel Cooling：
Diamond microchannels involve creating numerous fine channels within highly thermally conductive single-crystal diamond material, allowing coolant to flow directly near the heat source and thus dissipate heat from the chip more quickly.
Advantages:
1) Faster heat dissipation
2) Capable of handling hotter chips
3) Reduces the likelihood of the chip overheating and throttling
4) Suitable for scenarios where heat is highly concentrated
（Unmetallized microchannel diamond plates）
After diamond single crystals are fabricated into microchannels, they typically require a metal coating on their surface, particularly in packaging and thermal management applications.
1) Enhanced adhesion: The surface of diamond material is extremely hard and smooth, making it naturally difficult to form a strong bond with other materials; a metal coating increases adhesion to other materials (such as thermal interface materials and packaging materials).
2) Improved thermal conductivity: The metal layer acts as an efficient thermal bridge between the diamond and other heat dissipation materials, helping to better manage heat generated by the device.
3) Prevention of corrosion and wear: The metal coating protects the diamond surface from environmental factors (such as oxidation and corrosion) and physical damage.
（Metallized microchannel diamond plates）
Polycrystalline diamond prepared by chemical vapor deposition, offering high thermal conductivity and mechanical strength, suitable for various industrial processing and heat dissipation applications.
·Size: Diameter 1–150 mm, thickness 0.1–3.0 mm (customizable)
·Thermal Conductivity: 1200–1800 W/m·K
·Hardness: Mohs hardness 9.5
Industrial cutting tools, heat sinks
·High-Power Electronic Devices: Used for heat dissipation in high-power integrated circuits and RF devices, significantly enhancing thermal management capabilities and preventing performance degradation and failure due to overheating.
·LED Lighting: In high-power LED lighting, CVD polycrystalline diamond effectively dissipates large amounts of heat, extending LED lifespan and improving luminous efficiency.
Diamond-coated copper sheets adopt a single crystal/polycrystalline diamond and thin copper sandwich structure, combining the high thermal conductivity of diamond with the excellent electrical conductivity of copper.
·Size: Customized according to customer requirements
·Thermal Conductivity: 600–800 W/m·K
·Thickness: Diamond layer 0.3–1.0 mm, copper layer 0.1–0.5 mm
Heat dissipation for high-power electronic devices, power modules
·Power Modules: For heat dissipation in high-power modules, diamond-coated copper sheets provide excellent thermal conductivity while maintaining good electrical conductivity, ensuring stable module operation.
·Microelectronic Devices: In microelectronic devices, diamond-coated copper sheets effectively address thermal management issues, preventing performance degradation caused by heat accumulation.
·Improved Heat Dissipation: The ultra-high thermal conductivity (1800–2200 W/m·K) and extremely low thermal expansion coefficient (1.0 × 10⁻⁶/K) of CVD single crystal diamond effectively manage heat, preventing device overheating and maintaining stable performance.
·Reliability and Lifespan: Due to the high hardness and chemical stability of diamond materials, high-power electronic devices can operate stably over long periods in high-temperature and harsh environments, reducing failure rates.
·Thermal Management: CVD single crystal diamond substrates provide excellent thermal conductivity, rapidly dissipating heat and ensuring temperature stability during high-power laser operation, preventing thermal deformation and optical performance degradation.
·Optical Performance: Its high transparency in visible and infrared light ranges minimizes heat loss and improves laser output efficiency.
·Thermal Density Management: High thermal conductivity materials (such as CVD polycrystalline diamond and diamond-coated copper sheets) effectively dissipate heat, managing high-power density and preventing performance degradation caused by overheating.
·Compact Design: Diamond-copper composite materials combine the high thermal conductivity of diamond with the mechanical properties of copper, enabling more compact heat dissipation solutions and improving integration and performance.
·Thermal Stability: The high thermal conductivity of diamond materials ensures stable operation of communication equipment in high-frequency environments, preventing performance instability and failures caused by overheating.
·Equipment Lifespan: Effective heat dissipation management reduces thermal stress, improving long-term reliability and lifespan of equipment.
