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Diamond Heat Spreader:Overcome Thermal Limits and Unleash Peak Device Performance
In modern high-power-density electronics such as 5G/6G RF amplifiers, laser diodes, high-performance computing (HPC) chips, and power modules, heat is the ultimate adversary of performance and reliability. Traditional thermal management materials are often pushed beyond their limits. Our CVD Diamond Heat Spreader is the revolutionary solution engineered for the most demanding thermal challenges.
Why Diamond? The Unmatched Material Supreme
Diamond possesses the highest known thermal conductivity of any natural material. Our Chemical Vapor Deposition (CVD) polycrystalline diamond heat spreaders conduct heat efficiently via phonons, offering thermal conductivity in the range of 1300 - 1800 W/mK, which significantly surpasses traditional metals like copper. This enables it to rapidly dissipate heat from critical hot spots, preventing localized overheating that can cause performance throttling, signal distortion, and reduced operational lifespan.
Beyond exceptional heat conduction, our diamond heat spreader also features high electrical resistivity (excellent insulation) and a relatively low coefficient of thermal expansion, providing better compatibility with semiconductor materials like Gallium Arsenide (GaAs) and Gallium Nitride (GaN) to minimize thermally induced stress and enhance package reliability.
Core Product Features & Specifications
Manufactured using advanced CVD processes and precision machining, each unit guarantees top-tier quality and consistency.
Superior Thermal Conductivity: Available in three standard grades (1300, 1500, 1800 W/mK) to match your
specific performance and cost requirements, capable of handling extreme heat fluxes from hundreds to over a thousand W/cm².
Precision Engineering: Features double-sided polishing for ultra-smooth surfaces. Nucleation side surface roughness < 30 nm Ra, growth side < 100 nm Ra, ensuring optimal contact with chips or substrates for minimal interfacial thermal resistance.
Flexible Dimensions: Standard products are available with diameters up to 65mm, with larger sizes (e.g., 100mm diameter) available upon request. Thickness ranges from 0.2mm to 1.0mm after polishing, catering to various packaging and thermal design needs.
Stringent Tolerances: Thickness tolerance is controlled within ±25 µm, with flatness better than 4 µm/cm, ensuring precision and reliability in packaging processes.
Exceptional Durability: Exhibits high wear resistance and fracture toughness, with a Young's modulus of 1000-1100 GPa, ensuring robust and stable performance.
Primary Applications
RF & Power Electronics: Heat dissipation for GaN HEMTs in 5G/6G base stations, radar systems, and satellite communication power amplifiers.
Optoelectronics: Heat sink substrate for high-power laser diodes, VCSELs, and LED arrays.
Advanced Computing: Integrated heat spreader lids or microchannel cooling substrates for CPUs, GPUs, and TPUs.
Aerospace & Defense Electronics: High-power modules where size, weight, and reliability are critical.
Why Choose Us?
We specialize in advanced diamond-based thermal solutions, offering products ranging from standard specifications to fully customized designs. Our technical team is ready to collaborate closely with you to provide the critical thermal management your next-generation high-power devices require, enabling smaller, more powerful, and more reliable product designs.
Contact us today for technical consultation and sample information tailored to your specific application.
Diamond Heat Spreader:Overcome Thermal Limits and Unleash Peak Device Performance
In modern high-power-density electronics such as 5G/6G RF amplifiers, laser diodes, high-performance computing (HPC) chips, and power modules, heat is the ultimate adversary of performance and reliability. Traditional thermal management materials are often pushed beyond their limits. Our CVD Diamond Heat Spreader is the revolutionary solution engineered for the most demanding thermal challenges.
Why Diamond? The Unmatched Material Supreme
Diamond possesses the highest known thermal conductivity of any natural material. Our Chemical Vapor Deposition (CVD) polycrystalline diamond heat spreaders conduct heat efficiently via phonons, offering thermal conductivity in the range of 1300 - 1800 W/mK, which significantly surpasses traditional metals like copper. This enables it to rapidly dissipate heat from critical hot spots, preventing localized overheating that can cause performance throttling, signal distortion, and reduced operational lifespan.
Beyond exceptional heat conduction, our diamond heat spreader also features high electrical resistivity (excellent insulation) and a relatively low coefficient of thermal expansion, providing better compatibility with semiconductor materials like Gallium Arsenide (GaAs) and Gallium Nitride (GaN) to minimize thermally induced stress and enhance package reliability.
Core Product Features & Specifications
Manufactured using advanced CVD processes and precision machining, each unit guarantees top-tier quality and consistency.
Superior Thermal Conductivity: Available in three standard grades (1300, 1500, 1800 W/mK) to match your
specific performance and cost requirements, capable of handling extreme heat fluxes from hundreds to over a thousand W/cm².
Precision Engineering: Features double-sided polishing for ultra-smooth surfaces. Nucleation side surface roughness < 30 nm Ra, growth side < 100 nm Ra, ensuring optimal contact with chips or substrates for minimal interfacial thermal resistance.
Flexible Dimensions: Standard products are available with diameters up to 65mm, with larger sizes (e.g., 100mm diameter) available upon request. Thickness ranges from 0.2mm to 1.0mm after polishing, catering to various packaging and thermal design needs.
Stringent Tolerances: Thickness tolerance is controlled within ±25 µm, with flatness better than 4 µm/cm, ensuring precision and reliability in packaging processes.
Exceptional Durability: Exhibits high wear resistance and fracture toughness, with a Young's modulus of 1000-1100 GPa, ensuring robust and stable performance.
Primary Applications
RF & Power Electronics: Heat dissipation for GaN HEMTs in 5G/6G base stations, radar systems, and satellite communication power amplifiers.
Optoelectronics: Heat sink substrate for high-power laser diodes, VCSELs, and LED arrays.
Advanced Computing: Integrated heat spreader lids or microchannel cooling substrates for CPUs, GPUs, and TPUs.
Aerospace & Defense Electronics: High-power modules where size, weight, and reliability are critical.
Why Choose Us?
We specialize in advanced diamond-based thermal solutions, offering products ranging from standard specifications to fully customized designs. Our technical team is ready to collaborate closely with you to provide the critical thermal management your next-generation high-power devices require, enabling smaller, more powerful, and more reliable product designs.
Contact us today for technical consultation and sample information tailored to your specific application.
