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Gold-Plated CVD Diamond Substrates: High Performance, Ready for Integration
Our Diamond Substrates are high-purity CVD single crystal diamonds with a durable gold plating layer on the working surface. CVD diamond possesses the highest thermal conductivity of any bulk material [0†L18-L22], making it exceptionally effective at pulling heat away from high-power devices. The gold coating enables direct soldering, eutectic bonding, or wire bonding with standard assembly processes, so you can attach components immediately without extra surface preparation [0†L20-L22].
Diamond is also chemically inert and highly resistant to oxidation and corrosion [1†L26-L27]. This translates to long-term reliability even in harsh operating environments.
Key Properties
Our Diamond Substrates offer thermal conductivity that can be customized within a broad range (e.g., 1,000 to 1,800 W/m·K), depending on application requirements. The gold layer provides excellent electrical conductivity and is compatible with standard tin-silver (SnAg) and gold-tin (AuSn) solders. The substrate can be laser-cut to precise customer specifications, and the gold surface can be patterned to isolate multiple electrical pads on a single piece.
·Outstanding Heat Dissipation: Diamond’s extremely high thermal conductivity efficiently extracts heat from hotspots, protecting sensitive devices from thermal stress.
·Solder-Ready Surface: The gold plating eliminates the need for separate metallization processes, reducing production steps and avoiding the addition of less‑conductive thermal interface layers.
·Excellent Reliability: The metal‑diamond interface is engineered for strong adhesion, resisting peeling under thermal cycling and ensuring stable performance over the product lifetime [2†L31-L35].
Applications
Engineers use our gold‑plated Diamond Substrates to solve thermal challenges across a range of industries:
·High‑Power Laser Diodes: As a heat spreader directly under the laser chip to efficiently extract heat from the active region.
·RF Power Amplifiers & GaN Devices: To lower junction temperatures, enabling higher output power without increasing device temperature.
·Power Electronics & IGBT Modules: As an electrically insulating, highly thermally conductive substrate for high‑voltage switching modules.
·High‑Performance Computing & LED Packaging: To spread heat from dense arrays of chips or emitters, preventing localized overheating.
Customisation & Additional Options
Beyond gold plating, we also offer silver, copper, and other metal coatings on our Diamond Substrates to match specific assembly workflows and electrical requirements. Custom dimensions, thicknesses, and metallisation patterns are available upon request.
Contact us to discuss how our gold‑plated Diamond Substrates can solve your toughest thermal management challenges.
